Products | Low temperature curing agent for one-component adhesives SUNMIDE LH-210
Release time:
2021-05-25
SUNMIDE LH-210 can be used as a low-temperature latent curing agent for epoxy resins and as a latent accelerator for dicyandiamide (DICY), a one-component epoxy resin system. As a low-temperature latent curing agent for epoxy resins, SUNMIDE LH-210 is very reactive and can cure epoxy resins at very low temperatures (such as 60°C). As a latent accelerator for dicyandiamide (DICY) curing systems, adding a small amount of SUNMIDE LH-210 can achieve a shorter gel time than the high-temperature curing time without affecting storage stability.
Basic physical properties of the product
Application Examples
Application Low temperature curing epoxy curing agent
Figure: Effect of curing temperature on gel time [different parts]
Application of low temperature curing epoxy curing agent
Product Q&A Time
What are the product features of Haiyi Enterprise
1 SUNMIDE LH-210?
Answer: It can be used as a accelerator or as a latent curing agent. It has a high glass transition temperature and good latency.
What technical requirements does Haiyi Enterprise
2 SUNMIDE LH-210 apply to?
Answer: Medium curing speed, good rheology, resistance to moisture and heat aging, and medium incubation period.
What is the recommended amount of Haiyi Enterprise
3 SUNMIDE LH-210 when used as a curing agent alone?
A: Generally, 10-25 copies are recommended, which can be adjusted according to actual requirements.
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E-mail:hy@haiyi21cn.com
Address: East Block, 3rd Floor, Mid-term Building, 2000 Zhongshan North Road, Putuo District, Shanghai
Hotline:
400-088-7155
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E-mail:hy@haiyi21cn.com
Address: East Block, 3rd Floor, Mid-term Building, 2000 Zhongshan North Road, Putuo District, Shanghai
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